ScanINSPECT provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive high-end AOI systems.

ScanINSPECT uses a simple Windows user interface integrated with an image-processing unit. This combination allows 100% inspection of ball or bump placement on a wide variety of substrates and device types including FR4, Ceramic, Wafer, Flip chip, BGA, CSP, etc. The system can be used either pre or post reflow.

ScanINSPECT's integration within the production environment provides inspection of ball or bump:

• Presence/Absence
• Size
• Position

Each device or substrate is placed into ScanINSPECT for 100% inspection. The balls or bumps are inspected and any errors are displayed on the screen. No more surprises!

ScanINSPECT is quickly programmed from a golden part in a few minutes. Corrections to the golden part can be quickly and easily made, if necessary.

ScanINSPECT's powerful 100% inspection process increases product yield by ensuring accurate ball or bump placement. Missing balls or bumps can result in reduced yield, lost production time and extensive rework.

Missing or misplaced balls or bumps are now automatically detected. Problems are identified and eliminated before substrates or devices are reflowed, permitting quick and easy rework.