ScanINSPECT SPI provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems.

ScanINSPECT SPI uses a simple Windows user interface integrated with a manual load table and image-processing unit. This combination allows 100% inspection of printed solder paste.

ScanINSPECT SPI provides 100% 2D non-contact verification of bridging, paste on pads, and the total area of solder paste before adding further value to the PCB.

Each part or substrate is placed from the printing machine into ScanINSPECT SPI for 100% inspection. The part is then accepted and continues on with the process or rejected for disposition. No more surprises!

ScanINSPECT WBI is quickly programmed from a golden part in a few minutes.

ScanINSPECT SPI's powerful inspection process increases product yield by ensuring accurate solder paste printing, thus, assisting with high yields and minimal rework and/or scrap.

Missing or defective solder paste can result in lost production time and extensive rework. SPI eliminates operator fatigue and tedium from the inspection task, and automatically verifies 100% of the paste.

Missing, paste off pad, bridging, and over/under print area solder paste defects are now automatically detected. Problems are found and eliminated before value is added to defective parts.

ScanINSPECT set up is fast and easy. In production, each board is shuttled in the system, automatically aligned and checked for defects with a PASS or FAIL inspection in seconds.

Failures are detected, logged and printed for easy analysis or rework.