ScanINSPECT WBI provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems.

ScanINSPECT WBI uses a simple Windows user interface integrated with a manual load table and image-processing unit. This combination allows 100% inspection of presence/absence of wire bonds.

ScanINSPECT' WBI provides 100% 2D non-contact verification of absence / presence of Al or Au wire bonds before adding further value to the assembly.

Provides offline inspection for low volume production or SPC sampling for high volume production.

Each part or substrate is placed from the wirebonder into ScanINSPECT WBI for 100% inspection. The part is then accepted and continues on with the process or rejected for disposition. No more surprises!

ScanINSPECT WBI is quickly programmed from a golden part in a few minutes.

ScanINSPECT's powerful inspection process increases product yield by ensuring accurate wire bond placement. Thus, assisting with high yields and minimal rework and/or scrap.

Missing wire bonds can result in lost production time and extensive rework. WBI eliminates operator fatigue and tedium from the inspection task, and automatically verifies 100% of the bonds.

Missing wire bonds are now automatically detected. Problems are logged and eliminated before more value is added to defective parts.